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LDS8726
PIN DESCRIPTION
Pin #
1
2
3
4
5
6
Name
V IN
GND
PGND
SW
V OUT
HVB
Function
Input Voltage, connect to battery or power supply
Analog Ground
Power Ground
Switch input; Connect inductor terminal to this pin
Output voltage; Connect the LED string anode
terminal to this pin.
High Voltage Bypass; Connect a 470 pF capacitor
between this point and V OUT
7
LEDS
Current Sense input. Connect LED string cathode
terminal to this pin
Top view: TDFN 8-lead 2 X 3 mm
8
EN/PWM Device Enable (active high) and Dimming Control
PAD
PAD
Connect to GND on the PCB
PIN FUNCTION
V IN is the supply pin for the driver. A small 1 μ F
ceramic bypass capacitor is required between the V IN
pin and ground near the device. The operating input
voltage range is from 2.7 V to 5.5 V. If the input
supply voltage falls below the under-voltage
threshold, switch is disabled, and the device enters
shutdown mode.
HVB is the internal high voltage reference point.
Connect a 4700 pF capacitor between this point and
V OUT .
EN/PWM is the enable and PWM control logic input.
Guaranteed levels of logic high and logic low are set
at 1.4 V and 0.4 V respectively. When EN/PWM is
initially taken high, the device becomes enabled and
LED current sets to maximum programmed value..
To place the device into shutdown mode, the
EN/PWM pin must be held low for more than 10 ms.
V OUT is the driver output. Connect it to the LED
anode. A ceramic bypass capacitor of 1 μF requires
between the V OUT pin and ground near the device.
GND is the ground reference for the analog circuits.
The pin must be connected to the ground plane on
the PCB. Avoid high currents flowing trough traces
connecting this pin with EN/PWM signal source.
PGND is the current return for high current circuits.
The pin must be connected to the ground plane on
the PCB. Connect GND and PGND as close to the
driver as possible.
LEDS is the Current Sense pin that provides internal
regulated current sink for LED string. Connect LED
string cathode to this pin. This pin enter high-
impedance zero current state whenever the device is
in shutdown mode.
PAD is the exposed pad underneath the package.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane
? 2010 IXYS Corp.
Characteristics subject to change without notice
5
Doc. No. 8726DS, Rev. N1.0
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